Updated git submodules
authorHelen Chen <helen.chen@huawei.com>
Wed, 27 Jun 2018 01:34:10 +0000 (01:34 +0000)
committerGerrit Code Review <gerrit@onap.org>
Wed, 27 Jun 2018 01:34:10 +0000 (01:34 +0000)
Project: integration master 0a00eea3f8d3e08731dbf8b31be2f6c91e2b7337

Merge "Version bump demo artifacts to 1.3.0-SNAPSHOT"

Version bump demo artifacts to 1.3.0-SNAPSHOT

Change-Id: I0a4273f178d2190c57a239020e3749c69df81503
Issue-ID: INT-506
Signed-off-by: Gary Wu <gary.i.wu@huawei.com>
docs/submodules/integration.git

index d53317c..0a00eea 160000 (submodule)
@@ -1 +1 @@
-Subproject commit d53317c25c0c97acfb83a23aa38b9a7ebddb5560
+Subproject commit 0a00eea3f8d3e08731dbf8b31be2f6c91e2b7337