Updated git submodules
authorHelen Chen <helen.chen@huawei.com>
Wed, 27 Jun 2018 01:34:10 +0000 (01:34 +0000)
committerGerrit Code Review <gerrit@onap.org>
Wed, 27 Jun 2018 01:34:10 +0000 (01:34 +0000)
commit8f4c09ef481b9e28cd6279ecc0a429de5e010660
treef8b1af3324e233076a99249dd127051d54eb474d
parenta74c4d54bd028a31a0736922bac8fd21ac05f06f
Updated git submodules

Project: integration master 0a00eea3f8d3e08731dbf8b31be2f6c91e2b7337

Merge "Version bump demo artifacts to 1.3.0-SNAPSHOT"

Version bump demo artifacts to 1.3.0-SNAPSHOT

Change-Id: I0a4273f178d2190c57a239020e3749c69df81503
Issue-ID: INT-506
Signed-off-by: Gary Wu <gary.i.wu@huawei.com>
docs/submodules/integration.git