bump the release to 1.7.2 70/111770/1
authorseshukm <seshu.kumar.m@huawei.com>
Wed, 26 Aug 2020 17:41:47 +0000 (23:11 +0530)
committerseshukm <seshu.kumar.m@huawei.com>
Wed, 26 Aug 2020 17:41:47 +0000 (23:11 +0530)
commit8f5f54fc5bb6dfad1ae23fdf100a75bd2505c5d8
tree597626d6d187e4481e0aa8b982b116eb857668f9
parentcbfa15e606d92de453352790aa133136617e81e6
bump the release to 1.7.2

Issue-ID: SO-3167

Signed-off-by: seshukm <seshu.kumar.m@huawei.com>
Change-Id: I975d10469bcf63477397a3bd1fa833345af72437
version.properties