From be88a00b04604b676976215a5ee94054982c6ec2 Mon Sep 17 00:00:00 2001
From: Gary Wu <gary.i.wu@huawei.com>
Date: Fri, 8 Dec 2017 20:42:20 -0800
Subject: [PATCH] Updated git submodules

Project: integration master e493df4dd951d839ba9aeeb02b1b04e7f19d628d

Bump artifacts version

Change-Id: I96069ed7c554ffb567365eb7bec0da6c6170c012
Issue-ID: INT-278
Signed-off-by: Gary Wu <gary.i.wu@huawei.com>
---
 docs/submodules/integration.git | 2 +-
 1 file changed, 1 insertion(+), 1 deletion(-)

diff --git a/docs/submodules/integration.git b/docs/submodules/integration.git
index 546466470..e493df4dd 160000
--- a/docs/submodules/integration.git
+++ b/docs/submodules/integration.git
@@ -1 +1 @@
-Subproject commit 5464664702bc07c180ed82eb1a5d9bcc9e5d18ec
+Subproject commit e493df4dd951d839ba9aeeb02b1b04e7f19d628d
-- 
2.16.6