From 8f4c09ef481b9e28cd6279ecc0a429de5e010660 Mon Sep 17 00:00:00 2001
From: Helen Chen <helen.chen@huawei.com>
Date: Wed, 27 Jun 2018 01:34:10 +0000
Subject: [PATCH] Updated git submodules

Project: integration master 0a00eea3f8d3e08731dbf8b31be2f6c91e2b7337

Merge "Version bump demo artifacts to 1.3.0-SNAPSHOT"

Version bump demo artifacts to 1.3.0-SNAPSHOT

Change-Id: I0a4273f178d2190c57a239020e3749c69df81503
Issue-ID: INT-506
Signed-off-by: Gary Wu <gary.i.wu@huawei.com>
---
 docs/submodules/integration.git | 2 +-
 1 file changed, 1 insertion(+), 1 deletion(-)

diff --git a/docs/submodules/integration.git b/docs/submodules/integration.git
index d53317c25..0a00eea3f 160000
--- a/docs/submodules/integration.git
+++ b/docs/submodules/integration.git
@@ -1 +1 @@
-Subproject commit d53317c25c0c97acfb83a23aa38b9a7ebddb5560
+Subproject commit 0a00eea3f8d3e08731dbf8b31be2f6c91e2b7337
-- 
2.16.6