Updated git submodules
authorGary Wu <gary.i.wu@huawei.com>
Sat, 9 Dec 2017 04:42:20 +0000 (20:42 -0800)
committerGerrit Code Review <gerrit@onap.org>
Sat, 9 Dec 2017 04:43:25 +0000 (04:43 +0000)
Project: integration master e493df4dd951d839ba9aeeb02b1b04e7f19d628d

Bump artifacts version

Change-Id: I96069ed7c554ffb567365eb7bec0da6c6170c012
Issue-ID: INT-278
Signed-off-by: Gary Wu <gary.i.wu@huawei.com>
docs/submodules/integration.git

index 5464664..e493df4 160000 (submodule)
@@ -1 +1 @@
-Subproject commit 5464664702bc07c180ed82eb1a5d9bcc9e5d18ec
+Subproject commit e493df4dd951d839ba9aeeb02b1b04e7f19d628d