Updated git submodules
authorHelen Chen <helen.chen@huawei.com>
Fri, 16 Nov 2018 04:12:28 +0000 (04:12 +0000)
committerGerrit Code Review <gerrit@onap.org>
Fri, 16 Nov 2018 04:12:28 +0000 (04:12 +0000)
Project: integration master 7f6f476b19ba08ffb6ce11ed14e900e6a1a77a43

Merge "Version bump testsuite release image"

Version bump testsuite release image

Change-Id: I234f275b6e081745dcd2062ad5d46d7b482c1f1b
Issue-ID: INT-723
Signed-off-by: Gary Wu <gary.i.wu@huawei.com>
docs/submodules/integration.git

index 25548aa..7f6f476 160000 (submodule)
@@ -1 +1 @@
-Subproject commit 25548aa66199b3e7cb4e54204a862f97e4ae6d46
+Subproject commit 7f6f476b19ba08ffb6ce11ed14e900e6a1a77a43