Updated git submodules
authorGary Wu <gary.i.wu@huawei.com>
Sat, 9 Dec 2017 04:42:20 +0000 (20:42 -0800)
committerGerrit Code Review <gerrit@onap.org>
Sat, 9 Dec 2017 04:43:25 +0000 (04:43 +0000)
commitbe88a00b04604b676976215a5ee94054982c6ec2
tree98e066d9addea38b9d38a4ecf3cac15a344ede1f
parent8b9402916588a94e49196a3afeb6831d46e707ab
Updated git submodules

Project: integration master e493df4dd951d839ba9aeeb02b1b04e7f19d628d

Bump artifacts version

Change-Id: I96069ed7c554ffb567365eb7bec0da6c6170c012
Issue-ID: INT-278
Signed-off-by: Gary Wu <gary.i.wu@huawei.com>
docs/submodules/integration.git